SAN DIEGO, April 15, 2021 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH) ("GBT” or the “Company”), started research and development of Delta, a new EDA (Electronic Design Automation) ...
Tech Xplore on MSN
New semiconductor etching process achieves five-fold speed improvement
After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...
Semiconductors or integrated circuits are microelectronic devices made mostly of silicon or germanium. These chips, though tiny, comprise thousands of different components that work together to ...
The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...
Prior to becoming the CEO of VMWare in 2012, Pat Gelsinger was a long-time Intel employee dating back to the Andy Grove era and Chief Technology Officer under Craig Barrett and Paul Otellini. It’s ...
As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...
Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...
Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved ...
The booming development of AI applications is accelerating the advancement of IC process production, with fabless chipmakers also upgrading manufacturing specifications for their new products, ...
Tower ( (TSEM)) just unveiled an announcement. On November 12, 2025, Tower Semiconductor announced the expansion of its 300mm wafer bonding technology to support heterogeneous 3D-IC integration across ...
What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...
In 1782, Alessandro Volta was the first to use the term "semiconducting" to describe the electrical properties of certain materials. In 1833, Michael Faraday observed that the resistance of silver ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback