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A new semiconductor manufacturing process is said to make possible ICs with submicron geometry that can withstand as much as 30 V. Dubbed industrial CMOS (iCMOS) by its creators ...
Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, ...
3d
AZoNano on MSNHow 2D Materials Are Defining Tomorrow’s Electronics and ICsA pioneering review published in Nano-Micro Letters provides a thorough overview of the significance of two-dimensional (2D) materials in defining the future of electronics and integrated circuits ...
High-speed detection at two micrometres with monolithic silicon photodiodes. Jason J. Ackert 1, David J. Thomson 2, Li Shen 2, Anna C. Peacock 2, Paul E. Jessop 3, Graham T. Reed 2, Goran Z ...
High-Speed Chalcogenide Glass Supercharges CMOS ICs Aug. 30, 2017 After combining the glass with silicon to create a “hybrid” CMOS circuit, researchers saw processing speeds jump 100X.
However, the high power levels involved often don't lend themselves to development of monolithic solutions where control circuitry and power discretes are built on the same die.
Bridgewater, N.J. — The new S9684 series of photo ICs from Hamamatsu Corp. combines high sensitivity and high speed in a compact package for laser beam detection applications such as print start ...
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