That’s because TSMC finally made good on its promise to change its name structure for sub-2nm chips to one Apple already uses ...

SK hynix has showcased its next-gen HBM4 to the public: next-gen AI memory has up to 16-Hi stacks, 2TB/sec memory bandwidth, ...

Computing accelerators grow more complex with multi-chip designs. TSMC plans to stack logic chips while integrating power ...

TSMC unveiled its next-generation A14 manufacturing process during a symposium in the US last week. It will enter production ...

Chip packaging just got absurdly massive TSMC is pimping up its CoWoS (Chip-on-Wafer-on-Substrate) tech so that can cram an ...

A14 will harness 2nd Gen GAA nanosheet transistors, enhanced by its NanoFlex Pro technology, which enables greater ...

The first of these is called 18A-P, and promises another 8 percent performance per watt improvement over the base 18A node.

TSMC uses North America Technology Symposium to unveil more details abouts its next-generation advanced node, the A14.

The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

Samsung Electronics beat expectations in the first quarter of 2025, posting revenue of KRW79.1 trillion (US$55 billion) and ...