SK Hynix Inc., the world’s top DRAM memory chipmaker, aims to redefine the competitive landscape in artificial intelligence ...

Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image Sensor (CIS), NAND, DRAM, High Bandwidth Memory (HBM)).

Next, HBM makers like Micron, Samsung and SK hynix are transitioning toward HBM4 devices, which employ advanced packaging technologies such as copper-copper hybrid bonding to increase input/outputs, ...

In a press release, Applied Materials announced it had acquired a 9% stake in Dutch semiconductor assembly equipment maker BE ...

It enables chip designers to build system-in-packages (SiPs) of 3D-stacked logic, network and I/O chiplets, and HBM memory stacks ... manner using hybrid copper bonding (HCB).

Hybrid bonding overcomes these bottlenecks by providing direct copper-to-copper interconnects at pitches below ten microns, allowing logic and HBM stacks to exchange terabytes per second while ...