Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence ® Celsius ™ ...
Future Facilities announced a significant update to 6SigmaET, the company's powerful, intuitive and easy-to-learn thermal simulation tool for use by designers of electronic components and products.
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