TSMC reportedly still won't use new High-NA EUV lithography machines for its next-gen A14 (1.4nm) process node, will rely on ...

Intel has not yet fully committed to using the new High-NA EUV chipmaking tool in production and has an alternative ...

Bets on old-school lithography to dodge soaring costs TSMC, once the trendy pioneer of bleeding-edge chipmaking, is now ...

Taiwan Semiconductor Manufacturing is basking in the approval of the Trump administration for its U.S. investment plans.

Intel said on Tuesday that several of its contract manufacturing customers planned to build test chips for a forthcoming ...

More reports say that China is getting closer to building its own EUV lithography machine crucial when building chips below ...

Today's high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs ...

Bookings remain soft, with no new EUV orders from TSMC, raising questions around 2026 demand, despite unchanged 2025 guidance. China demand held up, but new export controls and tariff risks add ...

The new Intel 14A process node family uses RibbonFET 2, PowerDirect technology, and the use of ASML's bleeding-edge (worth ...

Intel’s been busy advancing its chip manufacturing, with two major nodes, 18A and 14A, leading the charge. During a recent ...

when it declined to use an earlier generation of EUV machines while TSMC pressed ahead with the technology. TSMC has not yet disclosed when it plans to adopt high-NA EUV machines for mass chip ...