TSMC reaffirmed that it will not use High-NA EUV lithography for its upcoming A16 and A14 process technologies, as Low-NA EUV tools combined with internal innovations provide sufficient scaling ...

TSMC reportedly still won't use new High-NA EUV lithography machines for its next-gen A14 (1.4nm) process node, will rely on old semiconductor equipment.

Intel’s answer to these advanced packaging demands is Foveros. They’ve introduced new solutions, Foveros-B and Foveros-R, ...

TSMC's upcoming process technologies — N2 (2nm-class) and A16 (1.6nm-class) — will rely solely on traditional EUV equipment with optics featuring a 0.33 numerical aperture (Low-NA).

AMD’s forthcoming “Medusa Ridge” desktop platform incorporates a redesigned client I/O die (cIOD) built on an advanced EUV process—likely 5 nm (N5) or 4 nm (N4P)—upgrading from the current 6 nm node.

Reports have emerged that the company is mulling shifting away from the tech to better compete with rival TSMC.

More than half of TSMC's revenues came from its smallest 5nm and 3nm nodes during the quarter, but it will reportedly stick with its existing low-NA EUV systems for its upcoming 2nm and 1.6nm nodes.