Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

Taiwan Semiconductor Manufacturing has outperformed 2024 expectations by wide margins. Check out 3 reasons to buy TSM stock.

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).

TSMC CEO C.C. Wei has dismissed recent market speculation indicating Nvidia is cutting back its demand for ...

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

Taiwan Semiconductor Manufacturing Co (TSMC, 台積電), a major chip supplier to Nvidia Corp and Apple Inc, yesterday said it aims ...

These are the most-read DIGITIMES Asia stories in the week of January 13 – January 17.

Nvidia ( NASDAQ:NVDA) is making a major shift in its AI chip packaging strategy, transitioning from CoWoS-S to CoWoS-L as it ...

TSMC (TSM.US)’s CoWoS is rumored to have faced order cuts and slackened production expansion, according to multiple media ...

TSMC's new U.S. plant is unlikely to get the most advanced chip technology before factories in Taiwan due to complex ...