The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging technologies is ...

AI chips required by generative AI rely on finely wired and processed equipment; thus, front-end process equipment manufacturers have shifted their focus to the advanced packaging solutions market as ...

The two funds target startups in areas such AI and renewable energy across Asia, the U.S. and the EMEA. Kyocera, one of the world’s largest chip component makers, has unveiled two funds totalling $100 ...

SANTA CLARA, Calif. and SINGAPORE, Nov. 18, 2024 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced plans to expand its global EPIC* innovation platform with a new collaboration model ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

We recently published 13 Best Semiconductor Equipment Stocks to Buy According to Hedge Funds. ACM Research, Inc. (NASDAQ:ACMR) is one of the stocks Jim Cramer recently discussed. ACM Research, Inc.

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...