Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
The Effect Of Pattern Loading On BEOL Yield And Reliability During Chemical Mechanical Planarization
Chemical mechanical planarization (CMP) is required during semiconductor processing of many memory and logic devices. CMP is used to create planar surfaces and achieve uniform layer thickness during ...
(Nanowerk News) Standard manufacturing techniques for semiconductor devices – the technologies that make electronics possible – involve processing raw materials at high temperatures in vacuum vessels.
Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
AURORA, Ill., Oct. 20, 2010 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and growing ...
A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...
In this article, the most common errors occurring at different stages of the semiconductor fabrication process and the strategies to mitigate them are discussed. The ever-growing complexity of the ...
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