SAN FRANCISCO — Kicking off the Semicon West trade show here on Monday (July 10), Applied Materials Inc. rolled out a trio of products, including new cleaning and deposition capabilities for its ...

The 300mm Applied Endura iLB II system provides an integrated combination of preclean, PVD Ti, and CVD TiN for depositing nano-scale films. In addition to enhanced bottom coverage and process symmetry ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Applied Materials, Inc. today celebrates the 20 th year of its Applied Endura ® platform, the most successful metallization system in the history of the ...

Contacts Applied Materials, Inc. Betty Newboe, 408-563-0647 (editorial/media) Paul Bowman, 408-563-1698 (financial community) ...

SANTA CLARA, Calif., May 19, 2015 - Applied Materials, Inc. today announced its Applied Endura® Cirrus(TM) HTX PVD* system with breakthrough technology for patterning copper interconnects at 10nm ...

SANTA CLARA, USA: Applied Materials Inc. launched its Applied Endura CuBS RFX PVD system, the only copper barrier/seed deposition technology qualified for 32 and 22nm production by logic and flash ...

Applied Materials’ Latest Integrated Materials Solution™ Extends Copper Wiring to 2nm and Beyond Applied Materials’ new Endura™ Copper Barrier Seed IMS™ with Volta™ Ruthenium CVD ...

The article Edwards' IPUP2 Vacuum Pump Sets New Standards for Load Lock and Transfer Chamber Applications originally appeared on Fool.com. Try any of our Foolish newsletter services free for 30 days .