PITTSBURGH, Sept. 29, 2014 /PRNewswire/ -- ANSYS announced today that its RedHawk(TM) and Totem(TM) products are certified for TSMC 16-nanometer (nm) FinFET+ (N16FF+), a second-generation FinFET ...
--Ansys today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18 A process technology. Intel Foundry and Ansys have also enabled a comprehensive ...
FLIR to Integrate a Thermal Sensor into ANSYS ’ Leading-Edge Driving Simulator to Model, Test, and Validate Thermal Imaging for Autonomous Vehicle Development ARLINGTON, Va.--(BUSINESS WIRE)--FLIR ...
Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
With its industry-standard tool for thermal and fluid analysis of space applications and satellites, C&R Technologies' thermal-centric modeling approach provides fast and effective system-level ...
uPI achieves a 2X improvement in thermal cycle endurance for their semiconductor product packages with Ansys' multiphysics simulation solutions Ansys' predictive simulation insights enable uPI to ...
CONCORD, N.H.--(BUSINESS WIRE)--Feb. 16, 2006--Aavid Thermal Technologies, Inc. (the "Company"), a leading developer of computational fluid dynamics ("CFD") software and provider of thermal management ...
PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...
Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...
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