The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the ...

The bonding process isn’t done with a flip-chip bonder. For finer pitch requirements, the industry generally uses thermal compression bonding (TCB). ... “Temporary bond/debond processes are needed for ...

A consortium successfully demonstrated the use of copper-copper (Cu-Cu) diffusion bonding technology, which could lead to reduced production costs for 3D chipset manufacturers. The new Cu-Cu ...

Explaining the precise COW process, Chujo comments, "More than 30,000 chips of various sizes were fabricated onto the waffle wafer, achieving enhanced bonding speed without any chip-detachment ...

Samsung’ industry-first WSP is a 16Gbit memory solution that stacks eight 2Gb NAND chips. The WSP generates a much smaller multi-chip package (MCP), which is… ...

Leti, an institute of CEA Tech, has announced the world’s first successful 300mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm and copper pads as small as 500nm ...

An automatic flip-chip bonder, the NEO HB has been designed for ± 1 µm 3σ post-bonding accuracy, in stand-alone or full automatic mode (EFEM) and is suitable for direct hybrid bonding processes. The ...

In one aspect, embodiments describe system on chip (SoC) die portioning and/or die splitting within an SiP structure (e.g. 3D memory package) in which IP cores such as CPU, GPU, IO, DRAM, SRAM ...

SUSS MicroTec SE and SET Corporation SA announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology. As part of the partnership, SUSS MicroTec and ...